Land side and die side cavities to reduce package z-height

A computing device, comprising:

• a PCB, having a first side and a second side;
• a package substrate, the package substrate having a die side, and a land side opposite the die side, the package substrate having a plurality of buildup layers, the package substrate mounted to the first side of the PCB;
• a die mounted to a die side of the package substrate;
• a cavity in an outermost layer of the land side of the package substrate;
• a capacitor mounted in the cavity, wherein the capacitor protrudes from the land side of the package substrate by a distance less than or equal to a thickness of the capacitor and wherein the capacitor protrudes from the land side of the substrate by a distance less than or equal to a land side solder bump thickness;
• and
• an antenna coupled to the PCB.

An apparatus, comprising:

• a package substrate, the package substrate having a die side, and a land side opposite the die side;
• a die coupled to the package substrate;
• a cavity on a land side of the package substrate;
• and
• a capacitor mounted in the cavity, wherein the capacitor protrudes from the land side of the package substrate by a distance less than or equal to a thickness of the capacitor.