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US 10,950,536 B2Granted
Packed interconnect structure with reduced cross coupled noise
AssigneeIntel Corporation
InventorsZhen Zhou, Jun Liao, Xiang Li, Kevin Stone, Daqiao Du, Tae-Young Yang, Ling Zheng, James A. McCall
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Abstract
An apparatus is described. The apparatus includes an electro-mechanical interface having angled signal interconnects, wherein, the angling of the signal interconnects is to reduce noise coupling between the angled signal interconnects.
Claims14
An apparatus, comprising:
- an electro-mechanical interface comprising angled signal interconnects, wherein, the angling of the signal interconnects is to reduce noise coupling between the angled signal interconnects, wherein the angled signal interconnects comprise diverging lower legs and converging upper legs, and wherein the angled signal interconnects correspond to different electrical nodes, wherein the electro-mechanical interface further comprises angled shielding interconnects between the angled signal interconnects.
A computer system, comprising:
- a plurality of processing cores;
- a main memory;
- a memory controller between the plurality of processing cores and the main memory;
- and,
- an electro-mechanical interface comprising angled signal interconnects, wherein, the angling of the signal interconnects is to reduce noise coupling between the angled signal interconnects, wherein the angled signal interconnects comprise diverging lower legs and converging upper legs, and wherein the angled signal interconnects correspond to different electrical nodes.
2 more elements
Dependencies are inferred from the claim text.