Package structure and method of manufacturing the same

A method of manufacturing a package structure, comprising following operations:

• (i) providing a redistribution structure, wherein the redistribution structure comprises a first circuit layer and a second circuit layer disposed over the first circuit layer, and the first circuit layer is electrically connected to the second circuit layer;
• (ii) forming at least one inner conductive reinforcing element over the redistribution structure, wherein the inner conductive reinforcing element comprises:
• a reinforcing layer having a Young's modulus in a range of from 30 to 200 GPa, wherein the reinforcing layer has a through hole;
• and
• a conductive connecting member disposed in the through hole, wherein a top and a bottom of the conductive connecting member are exposed outside the reinforcing layer and are electrically connected to the second circuit layer;
• a conductive member at the bottom of the conductive connecting member and electrically connected to the second circuit layer;
• (iii) disposing a chip over the redistribution structure, wherein the chip is electrically connected to the second circuit layer;
• and
• (iv) forming a first protective layer covering the chip and the inner conductive reinforcing element.