Substrate intermediary body, through-hole via electrode substrate, and through-hole via electrode formation method
AssigneeMitsui Chemicals, Inc.
InventorsYasuhisa Kayaba, Shoko Ono, Hirofumi Tanaka, Koji Inoue, Hiroko Wachi
Life of this patent
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Abstract
A substrate intermediary body includes: a substrate having a hole in a thickness direction, and a conductor being disposed in the hole; and an adhesion layer formed on a wall surface of the hole. The adhesion layer contains a reaction product of a polymer (A) having a cationic functional group and having a weight-average molecular weight of from 2,000 to 1,000,000 and a polyvalent carboxylic acid compound (B) having two or more carboxyl groups per molecule or a derivative thereof.
Claims11
A substrate intermediary body, comprising:
- a substrate having a hole provided in a thickness direction, and a conductor being disposed in the hole;
- an adhesion layer formed on a wall surface of the hole, and
- an insulating layer provided between the substrate and the adhesion layer,
- wherein the adhesion layer contains a chemical reaction product of a polymer (A) having a cationic functional group and having a weight-average molecular weight of from 2,000 to 1,000,000, and a polyvalent carboxylic acid compound (B) having two or more carboxyl groups per molecule or a derivative thereof, and wherein the polyvalent carboxylic acid compound (B) has an aromatic ring, wherein the chemical reaction product has at least one of an amide bond or an imide bond.
A substrate intermediary body, comprising:
- a substrate having a hole provided in a thickness direction, and a conductor being disposed in the hole;
- and
- an adhesion layer formed on a wall surface of the hole,
- wherein the adhesion layer contains a chemical reaction product of a polymer (A) having a cationic functional group and having a weight-average molecular weight of from 2,000 to 1,000,000, and a polyvalent carboxylic acid compound (B) having two or more carboxyl groups per molecule or a derivative thereof and wherein the polyvalent carboxylic acid compound (B) has an aromatic ring, wherein the chemical reaction product has at least one of an amide bond or an imide bond.
A through-hole via electrode formation method, comprising:
- forming a film containing a polymer (A) having a cationic functional group and having a weight-average molecular weight of from 2,000 to 1,000,000 on a wall surface of a hole of a substrate, the hole being provided in a thickness direction of the substrate;
- applying a polyvalent carboxylic acid compound (B) having two or more carboxyl groups per molecule, or a derivative thereof, onto the film containing the polymer (A);
- heating the film containing the polymer (A) and the polyvalent carboxylic acid compound (B) or the derivative thereof at from 200° C. to 425° C., thereby forming an adhesion layer;
- and
- forming an electrode in the hole in which the adhesion layer is formed,
- wherein the adhesion layer contains a reaction product of the polymer (A) and the polyvalent carboxylic acid compound (B) or the derivative thereof.
Dependencies are inferred from the claim text.