Semiconductor device package
AssigneeAdvanced Semiconductor Engineering Korea, Inc.
InventorsSoonheung Bae, Hyunjoung Kim
Life of this patent
Estimating the term…
Abstract
A semiconductor device package includes a substrate, a first insulation layer and an electrical contact. The first insulation layer is disposed on the first surface of the substrate. The electrical contact is disposed on the substrate and has a first portion surrounded by the first insulation layer and a second portion exposed from the first insulation layer, and a neck portion between the first portion and the second portion of the electrical contact. Further, the second portion tapers from the neck portion.
Claims19
A semiconductor device package, comprising:
- a substrate having a first surface and a second surface opposite to the first surface;
- a first insulation layer having a first surface and a second surface opposite to the first surface and attached to the first surface of the substrate;
- and an electrical contact disposed on the first surface of the substrate, wherein the electrical contact has a first portion arranged between the first surface of the substrate and an elevation of the first surface of the first insulation layer and a second portion protruding from the elevation of the first surface of the first insulation layer, wherein a projection area of the second portion of the electrical contact on the first surface of the substrate is smaller than a projection area of the first portion of the electrical contact on the first surface of the substrate;
- wherein the second portion tapers from the elevation of the first surface of the first insulation layer;
- a cavity formed on the first surface of the insulation layer and surrounding the electrical contact, and wherein a portion of a lateral surface of the first portion of the electrical contact is spaced from an inner wall of the cavity;
- wherein the first insulation layer comprises a filler having a surface coplanar with the inner wall of the first insulation layer that is spaced from the electrical contact.
A semiconductor device package, comprising:
- a substrate having a first surface and a second surface opposite to the first surface;
- a first insulation layer having a first surface and a second surface opposite to the first surface, the first insulation layer being disposed on the first surface of the substrate and attached to the first surface of the substrate;
- and an electrical contact disposed on the first surface of the substrate and partially surrounded by the first insulation layer wherein the first insulation layer has a cavity formed on the first surface of the insulation layer and surrounding the electrical contact, and wherein a portion of a lateral surface of the electrical contact is spaced from an inner wall of the cavity;
- wherein the electrical contact has a first portion arranged between the first surface of the substrate and an elevation of the first surface of the first insulation layer and a second portion protruding from the elevation of the first surface of the first insulation layer;
- wherein the first insulation layer comprises a filler, the filler having a surface coplanar with the first surface inner wall of the first insulation layer that is spaced from the electrical contact, the surface of the filler is being exposed.
Dependencies are inferred from the claim text.