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US 10,950,527 B2Granted
Semiconductor device and method for manufacturing the same
AssigneeRenesas Electronics Corporation
InventorsShoji Hashizume, Yasushi Takahashi
Life of this patent
Estimating the term…
Abstract
A chip mounting portion included in a semiconductor device has a region including a semiconductor chip in plan view. When an average surface roughness of the region is “Ra”, 0.8 μm≤Ra≤3.0 μm holds.
Claims8
A semiconductor device comprising:
- a chip mounting portion having a main surface;
- and
- a semiconductor chip mounted on the main surface of the chip mounting portion via solder, wherein the solder contains no silica particles,
- wherein the semiconductor chip is disposed on a first region of the main surface of the chip mounting portion, and
- wherein the first region of the main surface has an average surface roughness of 0.8 μm or more and 3.0 μm or less.
2 more elements
A semiconductor device comprising:
- a chip mounting portion having a main surface;
- and
- a semiconductor chip mounted on the main surface of the chip mounting portion via solder,
- wherein the semiconductor chip is disposed on a first region of the main surface of the chip mounting portion,
- wherein the first region of the main surface has an average surface roughness of 0.8 μm or more and 3.0 μm or less,
- wherein the main surface of the chip mounting portion includes:
- the first region;
- and
- a second region surrounding the first region, and
- wherein the average surface roughness of the first region is greater than an average surface roughness of the second region.
7 more elements
A semiconductor device comprising:
- a chip mounting portion having a main surface;
- a semiconductor chip mounted on the main surface of the chip mounting portion via solder;
- a lead spaced apart from the chip mounting portion and having one end portion and another end portion opposite one end portion which is arranged closer to the chip mounting potion than another end portion;
- and
- a wire connecting the semiconductor chip to the lead,
- wherein the semiconductor chip is disposed on a first region of the main surface of the chip mounting portion,
- wherein one end portion of the lead has a surface connected to the wire in plan view, and
- wherein an average surface roughness of the first region of the main surface of the chip mounting portion is greater than an average surface roughness of the surface of one end portion of the lead.
5 more elements
Dependencies are inferred from the claim text.