Fabrication method of packaging structure

A method for fabricating a packaging structure, comprising:

• providing a base substrate, including a solder pad body region and a trench region adjacent to and around the solder pad body region;
• forming a passivation layer, on a surface of the base substrate and exposing the solder pad body region and the trench region;
• forming a main body solder pad, on the solder pad body region of the base substrate;
• forming one or more trenches on the trench region of the base substrate and between the passivation layer and the main body solder pad;
• and
• forming a bonding conductive wire, having one end connected to the main body solder pad, wherein:
• the solder pad body region includes a contact region;
• the one end of the bonding conductive wire connected to the main body solder pad on the base substrate is in the contact region;
• the contact region and the trench region are spaced apart by a minimum distance;
• and
• the minimum distance is in a range of approximately 1-2 μm.