Electronic device
AssigneeShindengen Electric Manufacturing Co., Ltd.
InventorsJunya Yuguchi, Kousuke Ikeda, Kenichi Suzuki
Life of this patent
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Abstract
An electronic device has an electronic module having an insulating substrate 60, a conductor layer 20 provided on the insulating substrate 60, an electronic element 40 provided on the conductor layer 20 and a heat dissipation layer 10 provided on the insulating substrate in an opposite side of the electronic element 40 and a cooling body 100 which abuts on the heat dissipation layer 10. The cooling body 100 has a divided part 110 being provided at a portion which abuts on the heat dissipation layer 10 and being a plurality of divided regions.
Claims5
An electronic device comprising:
- an insulating substrate;
- a plurality of conductor layers provided on a first major surface of the insulating substrate;
- a plurality of electronic elements provided on the plurality of conductor layers respectively;
- a heat dissipation plate provided on a second major surface opposite the first major surface of the insulating substrate;
- and
- a cooling body in contact with the heat dissipation plate;
- wherein the cooling body is divided on a surface, which contacts with the heat dissipation plate, to a plurality of areas corresponding to the plurality of electronic elements;
- and
- wherein a plurality of groove parts are formed at the plurality of areas respectively.
Dependencies are inferred from the claim text.