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US 10,950,520 B2Granted
Electronic package, method for fabricating the same, and heat dissipator
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsYu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Kuo-Hua Yu, Wen-Shan Tsai, En-Li Lin, Kaun-I Cheng, Wei-Ping Wang
Life of this patent
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Abstract
An electronic package is provided. A heat dissipator is bonded via a thermal interface layer to an electronic component disposed on a carrier. The heat dissipator has a concave-convex structure to increase a heat-dissipating area of the thermal interface layer. Therefore, the heat dissipator has a better heat-dissipating effect.
Claims27
An electronic package, comprising:
- a carrier;
- at least one electronic component disposed on the carrier;
- and
- a heat dissipator comprising:
- a heat dissipating body bonded to the electronic component via a thermal interface layer and formed with a concave-convex structure having a plurality of convex portions and a plurality of concave portions, each of the concave portions being between any adjacent two of the convex portions, wherein at least two of the convex portions are ridge-shaped;
- and
- a supporting leg disposed on the heat dissipating body, bonded to the carrier, and supporting the heat dissipating body,
- wherein the at least two of the convex portions each have, at a bottom thereof, a first lateral side and a second lateral side opposing the first lateral side and differing from the first lateral side in width, and
- wherein the convex portions are arranged in a manner that the first lateral sides and the second lateral sides are interleaved.
6 more elements
A method for fabricating an electronic package, comprising:
- providing a heat dissipator, comprising:
- a heat dissipating body formed with a concave-convex structure having a plurality of convex portions and a plurality of concave portions, each of the concave portions being between any adjacent two of the convex portions, wherein at least two of the convex portions are ridge-shaped;
- and
- a supporting leg disposed on the heat dissipating body, wherein the at least two of the convex portions each have, at a bottom thereof, a first lateral side and a second lateral side opposing the first lateral side and differing from the first lateral side in width, and wherein the convex portions are arranged in a manner that the first lateral sides and the second lateral sides are interleaved;
- and
- bonding the heat dissipator to a carrier having at least one electronic component disposed thereon, with the supporting leg being bonded to the carrier and the heat dissipating body being bonded via a thermal interface layer to the electronic component.
3 more elements
A heat dissipator, comprising:
- a heat dissipating body formed with a concave-convex structure having a plurality of convex portions and a plurality of concave portions, each of the concave portions being between any adjacent two of the convex portions, wherein at least two of the convex portions are ridge-shaped;
- and
- at least one supporting leg disposed on the heat dissipating body, wherein the at least two of the convex portions each have, at a bottom thereof, a first lateral side and a second lateral side opposing the first lateral side and differing from the first lateral side in width, and wherein the convex portions are arranged in a manner that the first lateral sides and the second lateral sides are interleaved.
Dependencies are inferred from the claim text.