Semiconductor device, manufacturing method of semiconductor device, and electronic apparatus
AssigneeSony Semiconductor Solutions Corporation
InventorEiichirou Kishida
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Abstract
To prevent deterioration of light incident/emission environment in a semiconductor device in which a transmissive material is laminated on an optical element forming surface via an adhesive. The semiconductor device includes a semiconductor element manufactured by chip size packaging, a transmissive material which is bonded with an adhesive to cover an optical element forming surface of the semiconductor element, and a side surface protective resin which covers an entire side surface where a layer structure of the semiconductor element and the transmissive material is exposed.
Claims4
A semiconductor device comprising:
- a semiconductor element;
- a transmissive material configured to be bonded with an adhesive layer to cover an optical element forming surface of the semiconductor element;
- and
- a side surface protective resin configured to cover an entire side surface where a layer structure of the semiconductor element and the transmissive material is exposed, wherein the side surface protective resin has an eaves-like portion provided contacting sloped surfaces of the transmissive material, and wherein the eaves-like portion is formed to cover a non-light-receiving region or a non-light-emitting region of the optical element forming surface.
Dependencies are inferred from the claim text.