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US 10,950,514 B2Granted
Packaged semiconductor devices and methods of packaging semiconductor devices
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Chung-Shi Liu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng
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Abstract
Packaged semiconductor devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a packaged semiconductor device includes an integrated circuit die, a molding compound disposed around the integrated circuit die, and an interconnect structure disposed over the integrated circuit die and the molding compound. The molding compound is thicker than the integrated circuit die.
Claims20
A device comprising:
- an integrated circuit die having a first height;
- a molding compound laterally encapsulating the integrated circuit die, the molding compound having a second height, the second height greater than the first height, the first height and the second height each measured with respect to a backside of the integrated circuit die;
- a heat spreader disposed at a backside of the molding compound and the backside of the integrated circuit die;
- an interconnect structure disposed at a front side of the molding compound and a front side of the integrated circuit die;
- and
- a reflowable connector electrically connected to the interconnect structure.
3 more elements
A device comprising:
- a first integrated circuit die having a first surface and a second surface opposite the first surface, the first integrated circuit die comprising a first contact pad at the first surface;
- a first molding compound disposed around the first integrated circuit die, first molding compound having a third surface and a fourth surface opposite the third surface, the first molding compound being thicker than the first integrated circuit die in a first direction, the first direction extending between the third surface and the fourth surface, the fourth surface being coplanar with the second surface;
- an interconnect structure adjacent a major surface of the first molding compound and the first surface of the first integrated circuit die, the interconnect structure comprising a first conductive via;
- and
- a reflowable connector electrically connected to the first contact pad by the first conductive via.
2 more elements
A device comprising:
- a heat spreader;
- an interconnect structure comprising a first conductive via;
- a molding compound between the interconnect structure and the heat spreader, the molding compound having a first thickness measured in a first direction, the first direction extending from the heat spreader to the interconnect structure;
- an integrated circuit die in the molding compound, the integrated circuit die having a second thickness measured in the first direction, the second thickness less than the first thickness;
- a reflowable connector electrically connected to the integrated circuit die by the first conductive via;
- a package substrate electrically connected to the reflowable connector;
- and
- an underfill surrounding the reflowable connector.
5 more elements
Dependencies are inferred from the claim text.