Die carrier package and method of forming same
AssigneeMedtronic, Inc.
InventorsMark R. Boone, Mark E. Henschel
Life of this patent
Estimating the term…
Abstract
Various embodiments of a die carrier package and a method of forming such package are disclosed. The package includes one or more dies disposed within a cavity of a carrier substrate, where a first die contact of one or more of the dies is electrically connected to a first die pad disposed on a recessed surface of the cavity, and a second die contact of one or more of the dies is electrically connected to a second die pad also disposed on the recessed surface. The first and second die pads are electrically connected to first and second package contacts respectively. The first and second package contacts are disposed on a first major surface of the carrier substrate adjacent the cavity.
Claims15
A die carrier package, comprising:
- a carrier substrate comprising a first major surface, a second major surface, and a cavity disposed in the first major surface, wherein the cavity comprises a recessed surface;
- a first package contact disposed on the first major surface of the carrier substrate adjacent the cavity and electrically connected to a first die pad disposed on the recessed surface via a first conductor;
- a second package contact disposed on the first major surface of the carrier substrate adjacent the cavity and electrically connected to a second die pad disposed on the recessed surface via a second conductor;
- and
- a die disposed within the cavity of the carrier substrate, and comprising a first die contact disposed on an active surface of the die and a second die contact disposed on a major surface of the die that faces the recessed surface and that is opposed to the active surface, wherein the first die contact is electrically connected to the first die pad and the second die contact is electrically connected to the second die pad, wherein the die is adapted to emit electromagnetic radiation from its active surface.
A hermetically-sealed system, comprising:
- a housing comprising an inner surface and an outer surface;
- a device substrate hermetically sealed to the housing and comprising a first major surface and a second major surface;
- a die carrier package disposed on the first major surface of the device substrate and comprising a die that comprises an active surface facing the device substrate, wherein the die is adapted to emit light through the first and second major surfaces of the device substrate, wherein the die is disposed within a cavity of a carrier substrate of the package, wherein the die further comprises a first die contact disposed on the active surface of the die and a second die contact disposed on a major surface of the die that faces a recessed surface of the cavity of the die carrier package and that is opposed to the active surface, wherein the first die contact is electrically connected to a first package contact disposed on a first major surface of the carrier substrate of the package adjacent the cavity and the second die contact is electrically connected to a second package contact disposed on the first major surface of the carrier substrate of the package adjacent the cavity, wherein the first and second package contacts are disposed between the first major surface of the carrier substrate and the first and second major surfaces of the device substrate;
- and
- a detector disposed on the first major surface of the device substrate and comprising a detecting surface, wherein the detector is adapted to detect at least a portion of the light emitted by the die.
Dependencies are inferred from the claim text.