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US 10,950,509 B2Granted
Semiconductor device with integrated shunt resistor
AssigneeInfineon Technologies AG
InventorsRainald Sander, Thomas Bemmerl, Steffen Thiele
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Abstract
A semiconductor device includes a first chip pad, a power semiconductor chip arranged on the first chip pad and including at least a first and a second power electrode, and a clip connected to the first power electrode. In this case, an integral part of the clip forms a shunt resistor and a first contact finger of the shunt resistor is embodied integrally with the clip.
Claims13
A semiconductor device, comprising:
- a first chip pad;
- a power semiconductor chip arranged on the first chip pad and comprising at least a first and a second power electrode;
- and
- a clip connected to the first power electrode;
- wherein an integral part of the clip forms a shunt resistor;
- and
- wherein a first contact finger of the shunt resistor is embodied integrally with the clip.
4 more elements
Dependencies are inferred from the claim text.