Systems and methods for fixed focus ring processing

A chamber, comprising:

• a base with a bore hole, wherein the base is configured to secure a wafer at a first position on the base;
• a pin configured to extend through the bore hole and retract into the bore hole;
• and
• a focus ring horizontally surrounding the wafer at the first position and extending upwardly from the base, wherein the focus ring is immovably secured to the base, and wherein the pin is configured to move the wafer vertically between the first position and a second position above the focus ring, wherein the focus ring comprises an annular internal vertical wall defining an inner annulus region and a horizontal annular top surface such that a total height of the focus ring is defined by a distance from a top surface of the base to the horizontal annular top surface, and wherein the second position is located above the top horizontal annular surface by 25% to 100% of the total height of the focus ring.

A system, comprising:

• a semiconductor wafer processing chamber;
• a base contained within the semiconductor wafer processing chamber, the base being configured to secure a wafer at a first position and comprising a plurality of bore holes;
• a plurality of pins extending through the plurality of bore holes, respectively;
• a focus ring horizontally surrounding the wafer at the first position and extending upwardly from the base, wherein the plurality of pins are configured to move the wafer vertically between the first position and a second position above the focus ring, wherein the focus ring comprises an annular internal vertical wall defining an inner annulus region and a horizontal annular top surface such that a total height of the focus ring is defined by a distance from a top surface of the base to the horizontal annular top surface, and wherein the second position is located above the horizontal annular top surface by 25% to 100% of the total height of the focus ring;
• a slit valve formed on a side wall of the semiconductor wafer processing chamber at vertical position located above the annular top surface of the focus ring;
• a robotic arm configured to move the wafer horizontally between the second position and the slit valve via a robotic arm;
• and
• at least one processor, coupled to the plurality of pins and the robotic arm, the at least one processor being configured to control movement of the plurality of pins and the robotic arm.