Adhesive tape sticking apparatus and method of manufacturing a semiconductor package using the same

An adhesive tape sticking apparatus, comprising:

• a lower chamber including a bottom wall and a first sidewall defining a first inner space;
• an upper chamber including a top wall and a second sidewall defining a second inner space;
• a substrate support, wherein the substrate support is movable upward and downward within the lower chamber, and wherein the substrate support is configured to support a substrate;
• a differential pressure generator configured to generate a differential pressure between the first inner space and the second inner space when an adhesive tape sheet is disposed between the lower chamber and the upper chamber;
• and
• a tape support plate extending from an inner surface of an upper portion of the first sidewall toward a circumferential edge of the substrate,
• wherein the tape support plate and the substrate are configured to contact the adhesive tape sheet when the adhesive tape sheet bends downward toward the first inner space when the differential pressure is generated between the first and second inner spaces.

An apparatus, comprising:

• a first chamber comprising a first inner space;
• a second chamber comprising a second inner space;
• an adhesive tape sheet coupled to a ring frame, wherein the ring frame is disposed between the first chamber and the second chamber, and wherein the adhesive tape sheet creates an air tight seal between the first inner space and the second inner space;
• a first vacuum device connected to the first inner space, wherein the first vacuum device is configured to create a first pressure in the first inner space;
• a second vacuum device connected to the second inner space, wherein the second vacuum device is configured to create a second pressure in the second inner space;
• and
• a tape support plate disposed on a sidewall of one of the first and second chambers, wherein the tape support plate is positioned, shaped and dimensioned to contact and support at least a portion of the adhesive tape sheet when a pressure difference between the first and second inner spaces causes the adhesive tape sheet to bend toward the tape support plate,
• wherein the tape support plate is moveable along the sidewall of one of the first and second chambers, and
• wherein when the pressure difference is generated, the adhesive tape sheet rests substantially flat across an upper surface of the substrate to an adjacent edge of the tape support plate.