Method for manufacturing light emitting device

A method for manufacturing a light emitting device, comprising:

• forming a plurality of first light emitting elements on a first substrate, wherein a first number of the first light emitting elements are in a unit area of the first substrate;
• forming a plurality of second light emitting elements on a second substrate, wherein a second number of the second light emitting elements are in a unit area of the second substrate;
• performing a first transfer process to transfer the first light emitting elements on the first substrate to a transition carrier, wherein a third number of the first light emitting elements are in a unit area of the transition carrier, and the first number is greater than the third number;
• performing a second transfer process to transfer the second light emitting elements on the second substrate to the transition carrier, wherein the third number of the second light emitting elements are in the unit area of the transition carrier, the second light emitting elements are respectively disposed in correspondence with the first light emitting elements, and the second number is greater than the third number;
• forming a first package layer on the transition carrier to cover the first light emitting elements and the second light emitting elements, wherein the first light emitting elements and the second light emitting elements have different emission spectra;
• removing portions of the first package layer to form a plurality of package units, wherein each of the package units comprises at least one of the first light emitting elements and at least one of the second light emitting elements;
• performing a third transfer process to transfer the package units on the transition carrier to an array substrate;
• and
• removing another portions of the first package layer of the package units to expose the first light emitting elements and the second light emitting elements, wherein the first light emitting elements and the second light emitting elements of each of the package units are electrically conductively insulated from each other before the step of removing another portions of the first package layer of the package units, and the step of removing portions of the first package layer to form a plurality of package units.

A method for manufacturing a light emitting device, comprising:

• forming a plurality of light emitting elements on a substrate, wherein the light emitting elements are disposed on the substrate in a first density;
• performing a first transfer process to transfer the light emitting elements on the substrate to a transition carrier, wherein the light emitting elements are disposed on the transition carrier in a second density, and the first density is greater than the second density;
• disposing a plurality of electronic devices on the transition carrier, wherein the electronic devices are respectively disposed in correspondence with the light emitting elements;
• forming a first package layer on the transition carrier to cover the light emitting elements and the electronic devices;
• removing portions of the first package layer to form a plurality of package patterns and thereby form a plurality of package units, wherein each of the package units comprises at least one of the light emitting elements and at least one of the electronic devices;
• performing a second transfer process to transfer the package units on the transition carrier to an array substrate;
• removing the package patterns of the package units and exposing the light emitting elements and the electronic devices;
• and
• forming a plurality of connection electrodes to respectively electrically connect the respective light emitting elements to some control units on the array substrate and to respectively electrically connect the respective electronic devices to some other control units on the array substrate, wherein all of the light emitting elements and all of the electronic devices are electrically conductively insulated from each other before the step of forming the plurality of connection electrodes.