Method and apparatus for processing a substrate using non-contact temperature measurement

A method for substrate packaging comprising:

• positioning a substrate on a support surface of a substrate support disposed within a processing volume of a process chamber comprising a chamber body and a view port coupled to the chamber body;
• providing an infrared temperature sensor (IRTS) outside of the chamber body adjacent the view port;
• moving the IRTS relative to the view port to scan the substrate through the view port;
• and
• measuring a temperature of the substrate while the substrate is being processed in the processing volume,
• wherein scanning the substrate comprises outputting a beam from the IRTS at an angle of incidence relative to the substrate that creates an elliptical field of view.

A non-transitory computer readable storage medium having stored thereon instructions that when executed by a processor cause the processor to perform a method for substrate packaging comprising:

• positioning a substrate on a support surface of a substrate support disposed within a processing volume of a process chamber comprising a chamber body and a view port coupled to the chamber body;
• providing an infrared temperature sensor (IRTS) outside of the chamber body adjacent the view port;
• moving the IRTS relative to the view port to scan the substrate through the view port;
• and
• measuring a temperature of the substrate while the substrate is being processed in the processing volume,
• wherein scanning the substrate comprises outputting a beam from the IRTS at an angle of incidence relative to the substrate that creates an elliptical field of view.