Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
AssigneeToshiba Memory Corporation
InventorsJun Takagi, Shinichi Hirasawa
Life of this patent
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Abstract
In one embodiment, a semiconductor manufacturing apparatus includes a polishing table configured to hold a polishing pad, a polishing head configured to hold a substrate to be polished by the polishing pad, and a polishing liquid feeder configured to feed a polishing liquid to the polishing pad. The apparatus further includes a heat exchanger configured to be placed on the polishing pad and control temperatures of the polishing pad and the polishing liquid, and one or more protruding portions provided on a side face or a bottom face of the heat exchanger.
Claims20
A semiconductor manufacturing apparatus comprising:
- a polishing table configured to hold a polishing pad;
- a polishing head configured to hold a substrate to be polished by the polishing pad;
- a polishing liquid feeder configured to feed a polishing liquid to the polishing pad;
- a heat exchanger configured to be placed on the polishing pad and control temperatures of the polishing pad and the polishing liquid;
- and
- one or more protruding portions provided on a side face or a bottom face of the heat exchanger.
A method of manufacturing a semiconductor device, comprising:
- holding a polishing pad by a polishing table;
- feeding a polishing liquid to the polishing pad;
- placing, on the polishing pad, a heat exchanger provided with one or more protruding portions on a side face or a bottom face thereof;
- controlling temperatures of the polishing pad and the polishing liquid by the heat exchanger;
- and
- polishing a substrate by the polishing pad on which the polishing liquid is fed.
Dependencies are inferred from the claim text.