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AssigneeToshiba Memory Corporation
InventorsMakoto Minaminaka, Tsutomu Fujita, Keisuke Tokubuchi, Akira Tomono, Takanobu Ono
Estimating the term…
A semiconductor manufacturing apparatus according to an embodiment irradiates a semiconductor substrate with laser to form modified regions along an intended cut line in the semiconductor substrate. A light source emits the laser. An optical system comprises an objective lens configured to focus the laser in the semiconductor substrate. A light modulator is capable of modulating an energy density distribution of the laser. A controller controls the light modulator to displace a peak position of the energy density distribution of the laser from an optical axis of the objective lens in a relative movement direction of the optical system with respect to the semiconductor substrate.
A semiconductor manufacturing apparatus irradiating a semiconductor substrate with pulse laser to form modified regions along an intended cut line in the semiconductor substrate and to cut the semiconductor substrate, the apparatus comprising:
A semiconductor manufacturing apparatus irradiating a semiconductor substrate with pulse laser to form modified regions along an intended cut line in the semiconductor substrate and to cut the semiconductor substrate, the apparatus comprising:
Dependencies are inferred from the claim text.