Substrate processing method and substrate processing apparatus

A substrate processing method of processing a substrate, comprising:

• a) holding the substrate in a horizontal position, the substrate having a structure formed on an upper surface thereof;
• and
• b) supplying a processing liquid to said upper surface of said substrate to form a coating that is a film of said processing liquid on said upper surface of said substrate and to fill clearance in said structure with said processing liquid;
• wherein said substrate processing method further comprises, after said operation b),
• c) applying a stripping agent to a peripheral region of said upper surface of said substrate while rotating said substrate about a central axis pointing in an up-down direction, to strip off a portion of said coating that is formed on said peripheral region of said upper surface of said substrate from said substrate, and
• d) before, after, or in parallel with said operation c), injecting a gas toward only a boundary portion between said peripheral region of said upper surface of said substrate and an inner region of said upper surface of said substrate that is located inward of said peripheral region of said upper surface of said substrate, to accelerate solidification of only an outer edge portion of an inner region coating formed on said inner region of said upper surface of said substrate,
• wherein said substrate processing method further comprises
• e) after said operation c) and said operation d), solidifying said inner region coating formed on said inner region of said upper surface of said substrate, said inner region coating not having been solidified at the end of said operation c) and said operation d).