Method of cleaning substrate processing apparatus and system of cleaning substrate processing apparatus

A method of cleaning a substrate processing apparatus comprising:

• carrying a substrate into a chamber of the substrate processing apparatus with a substrate holder;
• drying the substrate having a surface wet by a cleaning liquid brought into contact with a supercritical fluid in the chamber of the substrate processing apparatus;
• a first vaporizing to vaporize the supercritical fluid into a supercritical gas;
• a first exhausting to remove the supercritical gas from an inside of the chamber of the substrate processing apparatus;
• carrying a jig only filled with the cleaning liquid into the chamber of the substrate processing apparatus with the substrate holder via a disc portion of the jig, the disc portion of the jig being configured to be held by the substrate holder by having a diameter and a thickness substantially equal to a diameter and a thickness of the substrate and the cleaning liquid being held in a ring-shaped portion of the jig protruding in a ring shape from a main surface of the disk portion;
• a second vaporizing to vaporize the cleaning liquid on the jig into a cleaning gas within the chamber of the substrate processing apparatus after the carrying;
• filling the inside of the chamber of the substrate processing apparatus with the cleaning gas;
• and
• a second exhausting to remove the cleaning gas formed in the second vaporizing from the inside of the chamber of the substrate processing apparatus after the filling and after a predetermined time.