Electronic device module and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsChang Ho Ok, Min Ryeol Eom
Life of this patent
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Abstract
An electronic device module includes a substrate having a ground region including ground pads spaced apart from each other, an electronic device mounted on the substrate and including a ground terminal bonded to the ground region, and a conductive adhesive bonding the ground pads and the ground terminal together, wherein an upper surface of the conductive adhesive includes a bonding surface bonded to the ground terminal, and a lower surface of the conductive adhesive includes bonding surfaces bonded to each of the ground pads, and an air path provided between the ground pads, through which gas generated in a process of mounting the electronic device on the substrate is discharged.
Claims5
An electronic device module comprising:
- a substrate comprising a ground region comprising ground pads spaced apart from each other;
- an electronic device mounted on the substrate and comprising a ground terminal bonded to the ground region;
- and
- a conductive adhesive bonding the ground pads and the ground terminal together,
- wherein an upper surface of the conductive adhesive comprises a single bonding surface bonded to the ground terminal, and a lower surface of the conductive adhesive comprises bonding surfaces bonded to each of the ground pads, and
- an air path provided between the ground pads, through which gas generated during a process of mounting the electronic device on the substrate is discharged.
Dependencies are inferred from the claim text.