Manufacturing trapezoidal through-hole in component carrier material

A method of manufacturing a component carrier, comprising:

• providing an electrically insulating layer structure having a front side and a back side, wherein the front side is covered by a first electrically conductive layer structure and the back side is covered by a second electrically conductive layer structure;
• carrying out a first opening process with a first laser drilling, through the first electrically conductive layer structure and into the electrically insulating layer structure from the front side to thereby form a blind hole in the electrically insulating layer structure;
• thereafter carrying out a second opening process with a second laser drilling, through the second electrically conductive layer structure and through the electrically insulating layer structure from the back side to thereby extend the blind hole into a through hole with a substantially trapezoidal shape,
• wherein at least one of the first and the second electrically conductive layer structures comprises an overhang extending into the through hole and spaced with regard to the electrically insulating layer structure,
• forming material interfaces in regions between the first electrically conductive layer structure and an electrically conductive filling material and between the second electrically conductive layer structure and the electrically conductive filling material,
• wherein at least one of the material interfaces is beak-shaped.