Shrouds and substrate treating systems including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsEdward Sung, Hyuk Kim, Daehyun Jang, Sung Il Cho
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AssigneeSamsung Electronics Co., Ltd.
InventorsEdward Sung, Hyuk Kim, Daehyun Jang, Sung Il Cho
Estimating the term…
Shrouds and substrate treating systems including the same are provided. Substrate treating systems may include a process chamber, a supporter, and a plasma source that is spaced apart from the supporter in a vertical direction. The substrate treating systems may also include a shroud configured to contain the plasma therein. The shroud may include a sidewall portion and a first flange portion extending horizontally from the sidewall portion and including a plurality of first slits that extend through a thickness of the first flange portion. The first flange portion may define a first opening, and a portion of the supporter may extend through the first opening. The sidewall portion may include a plurality of second slits, and each of the plurality of second slits may extend through a thickness of the sidewall portion and may extend from one of the plurality of first slits toward the plasma source.
A substrate treating system comprising:
A substrate treating system using plasma, the substrate treating system comprising:
A shroud configured to provide a space for plasma in a process chamber, the shroud comprising:
Dependencies are inferred from the claim text.