Stacked type capacitor without carbon paste layer, manufacturing method thereof and silver paste layer

A manufacturing method for a stacked type capacitor without a carbon paste layer, comprising:

• providing a metal foil;
• forming an oxide layer on an outer surface of the metal foil to entirely enclose the metal foil;
• forming a polymer composite layer on the oxide layer to partially enclose the oxide layer;
• wherein the polymer composite layer includes 0.1-5% by weight of a poly(3,4-ethylenedioxythiophene):polystyrene sulfonate (PEDOT:PSS) composite, 1-30% by weight of a conductive auxiliary, 0.1-15% by weight of a hydrogen bond type adhesive, 0.01-5% by weight of a silane coupling agent, 0.5-5% by weight of a water-soluble resin, and 0.001-1% by weight of a polyamine compound;
• wherein the conductive auxiliary is selected from the group consisting of polyol, dimethyl sulfoxide (DMSO), and N-methyl-2-pyrrolidone (NMP);
• the hydrogen bond type adhesive is selected from the group consisting of sorbitol and polyvinyl alcohol;
• the water-soluble resin is selected from the group consisting of water-based polyurethane, water-based polyethylene, polyester, and water-based polymethylmethacrylate;
• and the polyol is selected from the group consisting of ethylene glycol, glycerol, polyethylene glycol, and polyglycefine;
• and
• forming a silver paste layer directly on the polymer composite layer to directly enclose the polymer composite layer;
• wherein the oxide layer and the polymer composite layer are connected with each other to form a first connection interface between the oxide layer and the polymer composite layer, and the polymer composite layer and the silver paste layer are connected with each other directly without the carbon paste layer to form a second connection interface between the polymer composite layer and the silver paste layer.