Multi-layer ceramic capacitor and circuit board

A circuit board, comprising:

• a multi-layer ceramic capacitor including
• a ceramic body, and
• a first external electrode, a second external electrode, and a third external electrode that are formed on the ceramic body;
• and
• a mounting board including
• a first connection electrode connected to the first external electrode via a first solder,
• a second connection electrode connected to the second external electrode via a second solder, and
• a third connection electrode connected to the third external electrode via a third solder,
• the ceramic body including
• a first end surface and a second end surface that face each other in a first direction,
• a first side surface and a second side surface that face each other in a second direction orthogonal to the first direction,
• first internal electrodes drawn to the first end surface and the second end surface,
• second internal electrodes drawn to at least one of the first side surface and the second side surface, and
• dielectric layers,
• the first internal electrodes and the second internal electrodes being alternately laminated via the dielectric layers,
• the first external electrode covering the first end surface, extending to each of the first side surface and the second side surface, and being connected to the first internal electrodes,
• the second external electrode covering the second end surface, extending to each of the first side surface and the second side surface, and being connected to the first internal electrodes,
• the third external electrode including a first side-surface region formed on the first side surface and a second side-surface region formed on the second side surface, and being connected to the second internal electrodes,
• the first side-surface region and the second side-surface region being formed to be mutually shifted along the first direction and at least partially facing each other in the second direction.