System and method for encoding IC chips for payment objects

A system for providing integrated circuit (IC) chip modules for use in payment objects, comprising:

• a plurality of IC chip modules supportably interconnected to a first reel of flexible tape, each of the plurality of IC chip modules comprising an IC chip and interconnected antenna that are fixedly interconnected to a flexible carrier defined by different portions of said flexible tape;
• at least a first rotatable member engaging a first side edge portion of the flexible tape;
• at least one controller to provide position control signals for automated rotation of the first rotatable member and automated positioning of each of the plurality of IC chip modules at one or more of a plurality of predetermined positions along a travel path, free from fixed interconnection of the plurality of IC modules and the flexible tape to any card body or other support structure;
• at least one of a contact IC chip interface device and a non-contact IC chip interface device for encoding data in predetermined memory portions of each of the IC chips of the plurality of IC modules at said one of the plurality of predetermined positions, the data including personalization data provided by an issuer payment institution corresponding with a specific payment account administered by the issuer payment institution and issuer key data provided by the issuer payment institution, wherein said at least one controller provides encoding control signals to said at least one of a contact IC chip interface device and non-contact IC chip interface device for said data encoding.