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US 10,949,733 B2Granted
Semiconductor device and antenna label
AssigneeToshiba Memory Corporation
InventorMegumi Higuchi
Life of this patent
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Abstract
According to one embodiment, a semiconductor device includes a storage device in which a substrate is embedded and sealed in a mold, and an antenna label attached to the storage device. The antenna label is configured to provide a wireless communication function.
Claims5
A semiconductor device comprising:
- a storage device in which a substrate is embedded and sealed in a mold;
- an adhesive layer with a first through hole provided on a surface of the mold,
- a base material with a second through hole, the base material including a first surface in touch with the adhesive layer and a second surface opposite to the first surface;
- an antenna provided on the second surface of the base material, the antenna including a bump;
- and
- an insulating layer provided over the second surface of the base material and the antenna,
- wherein the bump of the antenna is embedded in at least one of the first through hole or the second through hole, and
- wherein the antenna is configured to provide a wireless communication function.
5 more elements
Dependencies are inferred from the claim text.