Manufacturing process of a pixel array of a thermal pattern sensor and associated sensor

Manufacturing process of a pixel array of a thermal pattern sensor, the process comprising the following steps:

• providing of a substrate (S);
• forming (E1) of a first layer (100) of electrically conductive material, including:
• depositing electrically conductive tracks extending in a first direction of elongation;
• depositing connector pins, extending from the tracks, in a second direction of elongation, different from the first direction of elongation, and moving towards a first edge of the substrate (S), called the output edge;
• depositing a ground strip intended to form the ground of the sensor;
• depositing (E2) a second layer (200) of pyroelectric material covering the tracks and leaving at least part of the connector pins free;
• depositing (E3) a third layer (300) of electrically conductive material placed between the layer of pyroelectric material and the ground strip without covering the free part of the connector pins;
• depositing (E4) a fourth layer (400) of dielectric material and extending in front of the tracks of the first layer;
• depositing (E5) a fifth layer (500) including electrically conductive heating tracks, said electrically conductive heating tracks extending from the ground strip to the first edge of the substrate (S) so as to be above the tracks of the first layer;
• depositing (E6) a sixth protective layer (600);
• wherein the step of depositing the second layer (200) and/or the step of depositing the third layer and/or the step of depositing the fourth layer and/or the step of depositing the sixth layer is carried out by slot-die coating.