Dynamic imaging system
AssigneeApplied Materials, Inc.
InventorsChing-Chang Chen, Chien-Hua Lai, Wei-Chung Chen, Shih-Hao Kuo, Hsiu-Jen Wang
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Abstract
Embodiments described provide dynamic imaging systems that compensates for pattern defects resulting from distortion caused by warpage of the substrate. The methods and apparatus described are useful to create compensated exposure patterns. The dynamic imaging system includes an inspection system configured to provide 3D profile measurements and die shift measurements of the first substrate to the interface configured to provide compensated pattern data to the digital lithography system configured to receive the compensated pattern data from the interface and expose the photoresist with a compensated pattern.
Claims17
A method of creating compensated exposure patterns, comprising:
- disposing a substrate on a stage of a dynamic imaging system, wherein the dynamic imaging system comprises:
- a slab with the stage disposed thereover;
- a digital lithography system disposed over the slab;
- and
- an inspection system;
- moving the stage under the inspection system to position a first area of the substrate under the inspection system;
- measuring a three-dimensional (3D) profile of the first area of the substrate using the inspection system;
- measuring a die-shift of at least one die in the first area of the substrate using the inspection system;
- providing the 3D profile measurements and the die-shift measurements to an interface of the dynamic imaging system, wherein a distributor sequences the 3D profile measurements and the die-shift measurements;
- determining a compensated pattern data for the first area of the substrate within the interface, wherein the compensated pattern data compensates for a warpage and the die shift on the substrate;
- and
- exposing a portion of the first area of the substrate to a compensated pattern using the digital lithography system, wherein the compensated pattern is determined from the compensated pattern data.
A method of creating compensated exposure patterns, comprising:
- measuring a location of a substrate with a photoresist disposed thereon;
- moving an area of the substrate beneath an inspection system;
- measuring a 3D profile of the area of the substrate using a warpage inspection tool within the inspection system;
- measuring a die-shift of at least one die in the area of the substrate using a die-shift inspection tool within the inspection system;
- providing the location of the substrate to an interface;
- providing the 3D profile measurements to the interface;
- providing the die-shift measurements to the interface, wherein a distributor sequences the 3D profile measurements and the die-shift measurements;
- determining a compensated pattern data for the area of the substrate within the interface, which compensates for a warpage and the die shift on the substrate;
- sending the compensated pattern data to a digital lithography system as a compensated pattern;
- and
- exposing the photoresist on the substrate to the compensated pattern using the digital lithography system.
A method of creating compensated exposure patterns, comprising:
- measuring a location of a first substrate with a first photoresist disposed thereon using a first encoder;
- moving an area of the first substrate beneath an inspection system;
- measuring a 3D profile of the area of the first substrate using a warpage inspection tool within the inspection system, wherein the warpage inspection tool comprises one or more laser triangulation modules;
- measuring a die-shift of at least one die in the area of the first substrate using a die-shift inspection tool within the inspection system without exposing the first photoresist, wherein the die-shift inspection tool comprises one or more automated optical inspection (AOI) modules;
- providing the location of the first substrate to an interface;
- providing the 3D profile measurements to the interface;
- providing the die-shift measurements to the interface, wherein a distributor sequences the 3D profile measurements and the die-shift measurements;
- determining a compensated pattern data for the area of the first substrate within the interface, which compensates for a warpage and the die shift on the first substrate;
- and
- exposing the first photoresist on the first substrate to a compensated pattern using a digital lithography system, wherein the compensated pattern is determined using the compensated pattern data.
Dependencies are inferred from the claim text.