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US 10,948,833 B2Granted
Wafer holding device and projection microlithography system
AssigneeCarl Zeiss SMT GmbH
InventorRolf Freimann
Life of this patent
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Abstract
A wafer holding device (200, 415) is configured to hold a wafer (205, 416) during operation of a microlithographic projection exposure apparatus and includes at least one sensor that is positionable in different rotational positions.
Claims16
An apparatus comprising:
- a wafer holding device configured to hold a wafer in a beam path of a microlithographic projection exposure apparatus, wherein the wafer holding device comprises:
- a plurality of sensors;
- and
- a first positioning arrangement configured to rotate each of the plurality of sensors in mutually differing rotational positions of the beam path independently from the wafer and from each other;
- and
- a mask holding device configured to hold a mask of the microlithographic projection exposure apparatus, wherein the mask holding device comprises:
- at least one measurement mask comprising at least one measuring structure;
- and
- a second positioning arrangement configured to position the at least one measurement mask in different rotational positions in an object plane of the microlithographic projection exposure apparatus.
6 more elements
A wafer holding device configured to hold a wafer during operation of a microlithographic projection exposure apparatus, comprising:
- a plurality of sensors and
- a positioning arrangement configured to rotate each of the plurality of sensors in different rotational positions independently from the wafer and from each other,
- wherein the plurality of sensors comprises at least one two-dimensional shearing grating configured to measure wavefront.
Dependencies are inferred from the claim text.