Method for removing photosensitive material on a substrate

An apparatus for processing a substrate, the apparatus comprising:

• a substrate support system configured to support a substrate, the substrate comprising a layer of photosensitive material on a surface thereof;
• and
• a substrate edge processing unit configured to remove photosensitive material from around an outer edge of the layer of photosensitive material,
• wherein the substrate edge processing unit is configured to control the removing of the photosensitive material so as to generate an edge around the layer of photosensitive material remaining on the surface of the substrate, the edge having a radial width,
• wherein the photosensitive material remaining on the surface of the substrate varies in thickness across the radial width of the edge so as to have a thickness profile, and
• wherein the substrate edge processing unit is configured to control the removing so as to control variation in the thickness profile along at least part of the length of the periphery of the edge and configured to control the variation in the thickness profile by supply of radiation, plasma or fluid from an outlet located above the substrate.

An apparatus for processing a substrate, the apparatus comprising:

• a substrate support system configured to support a substrate, the substrate comprising a layer of photosensitive material on a surface thereof;
• and
• a substrate edge processing unit configured to remove photosensitive material from around an outer edge of the layer of photosensitive material,
• wherein the substrate edge processing unit is configured to control the removing of the photosensitive material so as to generate a rough edge around the layer of photosensitive material remaining on the surface of the substrate, the rough edge having a protrusion with an apex at a distance from the surface of the substrate less than an average thickness of the remaining photosensitive material inward of the rough edge.