Photosensitive resin composition
AssigneeToray Industries, Inc.
InventorsYohei Kiuchi, Yu Shoji, Kimio Isobe
Life of this patent
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Abstract
A photosensitive resin composition includes an alkali-soluble resin (A) containing at least one selected from polyimides and precursors thereof, and polybenzoxazoles and precursors thereof, and a (meth)acryl group-containing compound (B) which constitutes a polyfunctional (meth)acryl group-containing silane condensate (B1) having a weight average molecular weight of 1,000 to 20,000, and having a plurality of structures represented by Formula (1), which is a condensate of compounds having a structure represented by Formula (1) and at least one structure selected from Formula (2-1), Formula (2-2), and Formula (2-3).
Claims6
A photosensitive resin composition, comprising
- an alkali-soluble resin (A) comprising at least one selected from polyimides and precursors thereof, and polybenzoxazoles and precursors thereof, and
- a (meth)acryl group-containing compound (B),
- wherein the (meth)acryl group-containing compound (B) comprises
- a polyfunctional (meth)acryl group-containing silane condensate (B1) having a plurality of structures represented by Formula (1), the silane condensate (B1) being a condensate of compounds having a structure represented by Formula (1) and at least one structure selected from Formula (2-1), Formula (2-2), and Formula (2-3), and
- the compound (B1) has a weight average molecular weight of 1,000 to 20,000,
- wherein in Formula (1), R1 is a hydrogen atom or a methyl group, m is an integer in a range of 1≤m≤4, and the symbol * indicates a binding site;
- wherein in Formula (2-1), R2 is a methyl group or an ethyl group, n is an integer in a range of 1≤n≤4, and the symbol * indicates a binding site;
- wherein in Formula (2-2), R2 is a methyl group or an ethyl group, n is an integer in a range of 1≤n≤4, and the symbol * indicates a binding site;
- and
- wherein in Formula (2-3), R2 is a methyl group or an ethyl group, n is an integer in a range of 1≤n≤4, and the symbol * indicates a binding site.
Dependencies are inferred from the claim text.