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US 10,948,817 B2Granted
Mold-forming substrate and inspection method
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsDaijitsu Harada, Masaki Takeuchi
Life of this patent
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Abstract
A circular mold-forming substrate of 125-300 mm diameter having a surface on which a topological pattern is to be formed is provided wherein the thickness of the substrate has a variation of up to 2 μm within a circle having a diameter of 125 mm.
Claims14
A circular mold-forming substrate comprising:
- an outer area and a circular mold role area;
- wherein the circular mold-forming substrate has a diameter of 125 mm to 300 mm;
- wherein the circular mold role area is an area that is capable of forming a topological pattern;
- wherein the outer area surrounds the circular mold role area;
- wherein the circular mold role area has a diameter of up to 125 mm;
- wherein a variation of thickness of the circular mold role area is up to 2 μm;
- wherein the circular mold-forming substrate satisfies the relationship:
- T≥C≥E;
- wherein within the circular mold role area has a thickness T at the thickest point t that first comes in contact with a resin layer on a recipient substrate, a thickness C at the center c, and a thickness E at point e that is the intersection between line t-c and the periphery of the circular mold role area which is remote from t and last comes in contact with the resin layer on the recipient substrate;
- and
- wherein the circular mold-forming substrate satisfies the relationship:
- 0.6 μm≥T-E≥0.3 μm.
9 more elements
Dependencies are inferred from the claim text.