Package structure for optical fiber and method for forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsSung-Hui Huang, Jui-Hsieh Lai, Shang-Yun Hou
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Abstract
A method for forming a package structure is provided, including: disposing an optical component and a waveguide over a first substrate; forming a passivation layer over the first substrate and covering the optical component and the waveguide; removing a portion of the passivation layer to form a first opening; and disposing a reflector over the passivation layer, wherein a metal layer of the reflector is formed in the first opening.
Claims20
A method for forming a package structure, comprising:
- disposing an optical component and a waveguide over a first substrate;
- forming a passivation layer over the first substrate and covering the optical component and the waveguide;
- removing a portion of the passivation layer to form a first opening;
- and
- disposing a reflector over the passivation layer, wherein a metal layer of the reflector is formed in the first opening.
A method for forming a package structure, comprising:
- disposing an optical component and a first waveguide over a substrate;
- forming a passivation layer over the substrate and covering the optical component and the first waveguide;
- disposing a reflector having a support structure and a metal layer over the passivation layer, wherein the metal layer is formed between the support structure and the substrate.
A method for forming a package structure, comprising:
- disposing an optical component and a waveguide over a substrate;
- forming a passivation layer over the substrate and covering the optical component and the waveguide;
- disposing a metal layer on a semiconductor layer to form a reflector;
- and
- disposing the reflector over the passivation layer and separated from the substrate.
Dependencies are inferred from the claim text.