Photonic component and method for production thereof

A photonic component (10) having a photonic integrated chip (1) and a fiber mount (5) mechanically connected to the photonic integrated chip (1), wherein the fiber mount (5) comprises:

• at least one groove (52), into which an optical fiber (30), in particular single-mode fiber, is inserted, and
• at least one mirror surface (52), which reflects radiation (S) of the fiber (30) in the direction of the photonic integrated chip (1) and/or reflects radiation (S) of the photonic integrated chip (1) in the direction of the fiber (30),
• characterized in that
• a chip stack (20) having at least two chips, of which one borders the fiber mount (5) and one borders the photonic integrated chip (1), is arranged between the photonic integrated chip (1) and the fiber mount (5),
• the chip stack (20) is provided with at least two through holes (21), and
• one guide pin (40) is guided through each of the at least two through holes (21) of the chip stack (20), which guide pin extends into an associated positioning hole in the fiber mount (5) and in the direction of the photonic integrated chip (1) and positions at least the chip stack (20) and the fiber mount (5) in relation to one another;
• and
• wherein the photonic integrated chip (1) comprises:
• a substrate (300), the substrate base material of which is a semiconductor material, in particular silicon,
• an integrated optical waveguide (360), which is integrated into at least one waveguiding material layer (320) of the chip located on the substrate (300),
• a deflection unit (370), and
• a pocket hole (310), which extends from the substrate rear side (301) up to a partition layer (311) separating the substrate (300) and the waveguiding material layer (320),
• wherein the deflection unit (370) deflects radiation (S) of the waveguide (360) out of the plane of the waveguiding material (320) in the direction of pocket hole (310) and substrate rear side (301) and deflects radiation (S) which comes from the chip stack (20) and has passed the pocket hole (310) and the partition layer (311) into the plane of the waveguiding material layer (320).