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US 10,948,169 B2Granted
LED lamp apparatus for vehicle
AssigneeHyundai Mobis Co., Ltd.
InventorHyun Woo Kang
Life of this patent
Estimating the term…
Abstract
Disclosed herein is an LED lamp apparatus for a vehicle, which includes a heat sink, a printed circuit board including an electric circuit and disposed on the heat sink, an LED disposed between the heat sink and the printed circuit board, the LED being in contact with the heat sink, and an electrode binder extending to the LED through the printed circuit board and electrically connecting the printed circuit board and the LED.
Claims13
A light-emitting diode (LED) lamp apparatus for a vehicle, comprising:
- a heat sink;
- a printed circuit board including an electric circuit and being disposed on the heat sink, the printed circuit board being rigid and further including a through-hole;
- an LED disposed between the heat sink and the printed circuit board, the LED being in contact with the heat sink;
- and
- an electrode binder extending to the LED through the through-hole in the printed circuit board, the electrode binder electrically connecting the printed circuit board and the LED.
2 more elements
A light-emitting diode (LED) lamp apparatus of a vehicle, comprising:
- a heat sink;
- an LED comprising:
- a base substrate;
- a light-emitting part formed on a first surface of the base substrate;
- an electrode formed on the first surface of the base substrate;
- and
- a heat sink joint coupling a second surface of the base substrate directly to the heat sink, the second surface opposing the first surface;
- a printed circuit board (PCB) disposed on the heat sink and overlapping a portion of the base substrate, the PCB being spaced apart from the light-emitting part and comprising:
- a through-hole overlapping the electrode;
- and
- an electric circuit configured to provide power to the electrode;
- and
- an electrode binder extending through the through-hole and forming an electric connection between the electric circuit and the electrode.
10 more elements
Dependencies are inferred from the claim text.