Stripping compositions for removing photoresists from semiconductor substrates
AssigneeFujifilm Electronic Materials U.S.A., Inc.
InventorsAtsushi Mizutani, William A. Wojtczak, Yasuo Sugishima
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Abstract
This disclosure relates to compositions containing 1) at least one water soluble polar aprotic organic solvent; 2) at least one quaternary ammonium hydroxide; 3) at least one carboxylic acid; 4) at least one Group II metal cation; 5) at least one copper corrosion inhibitor selected from the group consisting of 6-substituted-2,4-diamino-1,3,5-triazines; and 6) water. The compositions can effectively strip positive or negative-tone resists or resist residues, and be non-corrosive to bumps and underlying metallization materials (such as SnAg, CuNiSn, CuCoCu, CoSn, Ni, Cu, Al, W, Sn, Co, and the like) on a semiconductor substrate.
Claims41
A composition, comprising:
- 1) at least one water soluble polar aprotic organic solvent;
- 2) at least one quaternary ammonium hydroxide;
- 3) at least one carboxylic acid;
- 4) at least one Group II metal cation;
- 5) at least one copper corrosion inhibitor selected from the group consisting of 6-substituted-2,4-diamino-1,3,5-triazines;
- and
- 6) water.
A composition, comprising:
- 1) at least one water soluble polar aprotic organic solvent in an amount of at least about 75 wt % of the composition;
- 2) at least one quaternary ammonium hydroxide;
- 3) at least one copper corrosion inhibitor selected from the group consisting of 6-substituted-2,4-diamino-1,3,5-triazines;
- and
- 4) water.
Dependencies are inferred from the claim text.