US 10,947,426 B2 · Aqueous bonding composition

Abstract

Disclosed is an aqueous bonding composition comprises: (A) a saccharide; (B) an inorganic acid ammonium salt; and (C) a metal salt, wherein the metal salt (C) comprises at least one selected from potassium salts, calcium salts, sodium salts, and magnesium salts. The aqueous bonding composition is excellent in balance among bending strength, bending strength under wet condition, water-absorption thickness expansion coefficient, and peeling strength. The aqueous bonding composition can be usefully used to produce a wood-based material. Further, a wood-based material obtainable by using the aqueous bonding composition is provided.

Claims8

Dependent claims

An aqueous bonding composition consisting essentially of:

(A) a saccharide;
(B) an inorganic acid ammonium salt;
and
(C) a metal salt that is potassium sulfate, sodium chloride, magnesium sulfate or magnesium chloride
wherein the aqueous bonding composition is characterized as having a cure profile of 140 to 170° C., 0.5 to 6.0 MPa for 3 to 7 minutes.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

15/883,185Filed 30 Jan 2018 · continuation

Priority

JP JP2015-1547765 Aug 2015

Published

US 2018/0155583 A17 Jun 2018

Granted

16 Mar 2021

Term ends

Not estimatedThe source records don’t support an estimate.

Classification18 codes

C09J 105/00
Adhesives based on polysaccharides or on their derivatives, not provided for in
B32B 21/042
Comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material: of wood
C08K 3/16
Use of inorganic substances as compounding ingredients: halogen-containing compounds
C08K 3/30
Use of inorganic substances as compounding ingredients: sulfur-, selenium- or tellurium-containing compounds

Abstract

Facts

Application

15/883,185Filed 30 Jan 2018 · continuation

Priority

JP JP2015-1547765 Aug 2015

Published

US 2018/0155583 A17 Jun 2018

Granted

16 Mar 2021

Term ends

Not estimatedThe source records don’t support an estimate.

Classification18 codes

C09J 105/00
Adhesives based on polysaccharides or on their derivatives, not provided for in
B32B 21/042
Comprising wood as the main or only constituent of a layer, which is next to another layer of the same or of a different material: of wood
C08K 3/16
Use of inorganic substances as compounding ingredients: halogen-containing compounds
C08K 3/30
Use of inorganic substances as compounding ingredients: sulfur-, selenium- or tellurium-containing compounds

Aqueous bonding composition

Life of this patent

Abstract

Claims8

Aqueous bonding composition

Life of this patent

Abstract

Claims8