Adhesive composition comprising eutectic metal alloy nanoparticles

A conductive adhesive composition comprising:

• at least one epoxy resin;
• at least one polymer chosen from the group consisting of polyvinyl phenols and polyvinyl butyrals;
• at least one melamine resin;
• a plurality of eutectic metal alloy nanoparticles having an average particle size of about 1000 nanometers or less;
• and
• at least one solvent present in an amount ranging from about 60% to about 90% based on a total weight of the conductive adhesive composition,
• wherein the conductive adhesive composition does not comprise any additional conductive element other than the plurality of eutectic metal alloy nanoparticles,
• wherein the plurality of eutectic metal alloy nanoparticles is present in the conductive adhesive composition in an amount ranging from about 60% to about 95%, based on a total solids weight of the conductive adhesive composition, and
• wherein the at least one solvent is selected from the group consisting of propylene glycol methyl ether acetate, di(propylene glycol) methyl ether acetate, (propylene glycol)methyl ether, di(propylene glycol)methyl ether, methyl isobutyl ketone, diisobutyl ketone, and 1-phenoxy-2-propanol.