US 10,947,419 B2 · Method for joining dissimilar materials

Abstract

A composition of matter includes a first compatible material having particles containing chemical elements similar to a first substrate, and second compatible material having particles containing chemical elements similar to a second substrate, wherein the first substrate and the second substrate are chemically different. The particles are dispersed into a matrix that is in between the first and the second substrate. A deposition system has a multi-material printhead, a first reservoir of a first compatible material having particles containing chemical elements similar to a first substrate, a second reservoir of a second compatible material having particles containing chemical elements similar to a second substrate, a third reservoir of an polymer precursor material, and at least one mixer. A method of bonding a joint between dissimilar substrate materials includes functionalizing a first compatible material having chemical elements similar to a first substrate, mixing the first compatible material with a polymer precursor material, functionalizing a second compatible material having chemical elements similar to a second substrate, mixing the second compatible material with a polymer precursor material, and using the deposition system to deposit the first and second compatible materials and a polymer precursor material on the joint between the first and second substrate materials.

Claims21

Dependent claims

A multilayer structure comprising:

a first substrate;
a second substrate chemically different from the first substrate;
a curable matrix between the first and second substrate;
particles of a first compatible material functionalized with chemical functions capable of reacting with the curable matrix during curing to form a network of chemically linked particles, the particles containing chemical elements similar to the first substrate;
and
particles of a second compatible material functionalized with chemical functions capable of reacting with the curable matrix during curing to form a network of chemically linked particles, the particles being chemically different from the particles of first compatible material and containing chemical elements similar to the second substrate;
wherein the particles of first compatible material are dispersed in the curable matrix and are present in a first concentration gradient where the concentration increases in a region approaching the first substrate;
and
wherein the particles of second compatible material are dispersed in the curable matrix and are present in a second concentration gradient where the concentration increases in a region approaching the second substrate.

6 more elements

A composition of matter, comprising:

a first substrate;
a curable matrix on the first substrate, wherein the curable matrix has an exposed bonding surface;
particles of a first compatible material functionalized with chemical functions capable of reacting with the curable matrix during curing to form a network of chemically linked particles, the particles containing chemical elements similar to the first substrate;
and
particles of a second compatible material functionalized with chemical functions capable of reacting with the curable matrix during curing to form a network of chemically linked particles, the having particles being chemically different from the particles of the first compatible material and containing chemical elements similar to a second substrate, which is to be contacted with the bonding surface of the curable matrix;
wherein the particles of first compatible material are dispersed in the curable matrix and are present in a first concentration gradient where the concentration increases in a region approaching the first substrate;
and
wherein the particles of second compatible material are dispersed in the curable matrix and are present in a second concentration gradient where the concentration increases in a region approaching the bonding surface of the curable matrix.

5 more elements

A composition of matter, comprising:

a first substrate;
a curable matrix of a two-part epoxy adhesive consisting of an epoxy material and a hardener material, wherein the curable matrix has an exposed bonding surface;
particles of a first compatible material functionalized with chemical functions capable of reacting with the epoxy material or the hardener material during curing to form a network of chemically linked particles, the particles containing chemical elements similar to the first substrate;
and
particles of a second compatible material functionalized with chemical functions capable of reacting with the epoxy material or the hardener material during curing to form a network of chemically linked particles, the particles being chemically different from the particles of the first compatible material and containing chemical elements similar to a second substrate, which is to be contacted with the bonding surface of the curable matrix;
wherein the particles of first compatible material are dispersed in the curable matrix and are present in a first concentration gradient where the concentration increases in a region approaching the first substrate;
and
wherein the particles of second compatible material are dispersed in the curable matrix and are present in a second concentration gradient where the concentration increases in a region approaching the bonding surface of the curable matrix.

5 more elements

Dependencies are inferred from the claim text.

Method for joining dissimilar materials

Life of this patent

Method for joining dissimilar materials

Life of this patent

Abstract

Claims21