Curable resin composition, cured product thereof, and semiconductor device
AssigneeDaicel Corporation
InventorsYasunobu Nakagawa, Shinya Yabuno
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AssigneeDaicel Corporation
InventorsYasunobu Nakagawa, Shinya Yabuno
Estimating the term…
An objective of the present invention is to provide a curable resin composition for forming a cured product having excellent heat resistance, light resistance, flexibility, and toughness. The present invention provides a curable resin composition containing the following components in specific blended amounts. (A): A polyorganosiloxane represented by average unit formula: (SiO4/2)a1(R1SiO3/2)a2(R12SiO2/2)a3(R13SiO1/2)a4 R1 is alkyl, aryl, alkenyl, or the like; a proportion of the alkyl is from 30 to 98 mol %, a proportion of the aryl is from 1 to 50 mol %, and a proportion of the alkenyl is from 1 to 20 mol % relative to a total amount of R1; and a1>0, a2>0, a3≥0, a4>0, 0.01≤a1/a2≤10, and a1+a2+a3+a4=1. (B): A polyorganosiloxane having not more than 10 silicon atoms and having a proportion of an alkenyl group relative to a total amount (100 mol %) of the organic groups bonded to the silicon atom from 20 to 60 mol %. (C): An organopolysiloxane represented by average unit formula below: (RxSiO3/2)x1(Rx2SiO2/2)x2(Rx2SiRARx2SiO2/2)x3(Rx3SiO1/2)x4 where Rx is alkyl, aryl, alkenyl, or the like; a proportion of the aryl relative to a total amount of Rx is from 1 to 50 mol %, and at least two of all the Rx moieties are alkenyl; RA is a divalent hydrocarbon group; and 0.05>x1≥0, x2+x3>0, x4>0, and x1+x2+x3+x4=1. (D) A polyorganosiloxane represented by average composition formula below: R2mHnSiO[(4-m-n)/2] where R2 is alkyl or aryl, and at least two silicon atoms are bonded to hydrogen atoms; and 0.7≤m≤2.1, 0.001≤n≤1, and 0.8≤m+n≤3. (E): A hydrosilylation catalyst.
A curable resin composition comprising:
A curable resin composition comprising:
A curable resin composition comprising:
A curable resin composition comprising:
Dependencies are inferred from the claim text.