Resin composition
AssigneeMitsubishi Chemical Corporation
InventorsTakeshi Kato, Akira Ishikubo, Yu Echigo, Mika Matsumoto, Jiro Sugiyama
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Abstract
A resin composition for insulating coating material, comprises: a polyimide resin and/or a precursor thereof; and a polymer having a heterocyclic ring at a side chain, wherein the content of the polymer having a heterocyclic ring at a side chain is 0.1 to 7 parts by weight relative to 100 parts by weight of the polyimide resin and/or the precursor thereof. By adding a prescribed amount of the polymer having a heterocyclic ring at a side chain, there can be obtained a resin composition for insulating coating material still maintaining heat resistance and together having excellent bending resistance.
Claims16
A resin composition for insulating coating material, comprising:
- a polyimide resin and/or a polyamic acid thereof;
- and a polymer having a heterocyclic ring at a side chain, wherein the content of the polymer having a heterocyclic ring at a side chain is 0.1 to 7 parts by weight relative to 100 parts by weight of the polyimide resin and/or the polyamic acid thereof,
- where the polymer having a heterocyclic ring at a side chain is one or two or more selected from the group consisting of polyvinylpyridine and copolymers containing vinylpyridine as a copolymerization component.
Dependencies are inferred from the claim text.