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US 10,947,326 B2Granted
Adhesive composition, cured article, semiconductor device, and production method for same
AssigneeShowa Denko Materials Co., Ltd.
InventorsSadaaki Katou, Takuya Komine, Shinjiro Fujii
Life of this patent
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Abstract
An adhesive composition comprising (a) a (meth)acrylic polymer, (b) a compound having at least two (meth)acryloyl groups, (c) a polymerization initiator and (d) a filler.
Claims19
An adhesive composition comprising:
- (a) a (meth)acrylic polymer;
- (b) a compound having at least two (meth)acryloyl groups, a content of the compound
- (b) relative to a total of 100 parts by mass of the component (a) and the component (b) being 20 parts by mass or more;
- (c) a polymerization initiator;
- and
- (d) a filler.
3 more elements
Dependencies are inferred from the claim text.