MEMS microphone and manufacturing method for making same

A manufacturing method for MEMS structure, comprising following steps:

• S1:
• providing a substrate, including a structural layer and a silicon-based layer overlapped with the structural layer;
• S2:
• carrying out a main etching process for etching out a cavity hole from an end of the silicon-based layer, which is far away from the structural layer, in a direction toward the structural layer until the cavity hole contacts the structural layer;
• and
• S3:
• carrying out an over-etching process for deepening the cavity hole and control an included angle α between a side wall of the cavity hole and the structural layer to be larger than 10° but smaller than 90°;
• the angle α is between a plane where the structural layer is and a tangent line of the side wall of an intersection of the structural layer and the cavity hole;
• the angle α faces the cavity hole and is right on a side of the plane close to the structure layer.