Semiconductor component and method for producing same

A method for producing a semiconductor component, the method comprising:

• providing a housing, wherein at least one semiconductor chip is arranged in a cavity of the housing, and wherein an electrical contact of the semiconductor chip is connected to an electrical contact of the housing via a bond wire;
• applying a protective material at a first region including on the electrical contact of the semiconductor chip and also on a region of the bond wire which is adjacent to the electrical contact of the semiconductor chip, and applying the protective material at a second region including on the electrical contact of the housing and also on a region of the bond wire which is adjacent to the electrical contact of the housing, wherein the first region and the second region are separated by a gap;
• and
• filling at least one partial region of the cavity, including the gap, with a gel.