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US 10,946,658 B2Granted
Encapsulating a bonded wire with low profile encapsulation
AssigneeHewlett-Packard Development Company, L.P.
InventorsChien-Hua Chen, Michael W. Cumbie, Zhuqing Zhang
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Abstract
Encapsulating a bonded wire with low profile encapsulation includes applying encapsulation over a bonded wire that is connected to a die on a first end and to a circuit component on a second end and truncating a shape of the encapsulation to form a truncated shape.
Claims4
A method for encapsulating a bonded wire with low profile encapsulation, comprising:
- applying an encapsulation material over a bonded wire, the bonded wire being connected to a die on a first end, and the bonded wire being connected to a circuit component on a second end;
- positioning a shaping guide on a top side of an initially applied portion of the encapsulation material to create a gap between an underside of the shaping guide and a top side of the circuit component,
- wherein the underside of the shaping guide includes a spacer to create the gap between the underside of the shaping guide and the top side of the circuit component;
- and
- shaping, using the shaping guide, and while applying the encapsulation material over the bonded wire, the encapsulation material into a truncated shape having a truncated height,
- wherein the truncated shape reflects a geometry of an underside of the shaping guide, and
- wherein the truncated height is less than a hundred microns in height.
4 more elements
Dependencies are inferred from the claim text.