Diecut, in particular for permanently closing holes
AssigneeTesa SE
InventorsKatja Meyer, Matthias Seibert
Life of this patent
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Abstract
Diecuts are configured for permanent closing of holes and have a carrier comprising an assembly of at least two polymeric films. An upper film of the at least two polymeric films has a basis weight of at least 1.0 kg/m2 and a lower film of the at least two polymeric films consisting of at least two layers, wherein a first layer is in the form of a polymeric film and faces the upper film, and a second layer is in the form of a functional layer with a side of the lower film, facing away from the upper film, bears an applied adhesive composition.
Claims20
A diecut configured for permanent closing of at least one hole, the diecut comprising:
- a carrier comprising an assembly of at least two polymeric films,
- wherein
- the at least two polymeric films comprise an upper film and a lower film, the upper film having a basis weight of at least 1.0 kg/m2 and the lower film consisting of at least two layers,
- the at least two layers of the lower film have a first layer in the form of a polymeric film facing the upper film and a second layer in the form of a functional layer,
- a side of the lower film facing away from the upper film has an applied adhesive composition
- the functional layer has a first barrier effect with respect to first migratable substances that are diffusible into the applied adhesive composition and a second barrier effect with respect to second migratable substances that are diffusible into the upper film,
- the first migratable substances comprise one or more oils, one or more lubricants, and one or more plasticizers,
- the second migratable substances comprise one or more tackifier resins, and
- a melting point of a polymer of the functional layer is above a melting point of a polymer of the upper film by 20° C.
Dependencies are inferred from the claim text.