Chemical mechanical polishing retaining ring with integrated sensor

A retaining ring for a carrier head having a mounting surface for a substrate comprising:

• an annular body having a central opening;
• a channel formed in the annular body that extends from an outer surface of the retaining ring to an inner surface;
• a sensor disposed within the channel, wherein the sensor is configured to detect acoustic and/or vibration emissions from processes performed on the substrate;
• a seal disposed within the channel between the sensor and the central opening;
• and
• a second sensor to detect if the seal has failed, wherein the second sensor is one of a humidity sensor or a pressure sensor,
• wherein the sensors are coupled to a transmitter via one or more electrical leads respectively, wherein the transmitter is a wireless transmitter configured to wirelessly transmit information from the sensor, and wherein the transmitter is disposed on an outer surface of the retaining ring.

A carrier head for a chemical mechanical polishing apparatus, comprising:

• a base;
• a retaining ring connected to the base, wherein the retaining ring comprises:
• an annular body having a central opening,
• a channel formed in the annular body that extends from an outer surface of the retaining ring to an inner surface,
• a sensor disposed within the channel, wherein the sensor is configured to detect acoustic and/or vibration emissions from chemical mechanical polishing processes,
• a seal disposed within the channel between the sensor and the central opening, and
• a second sensor to detect if the seal has failed, wherein the second sensor is one of a humidity sensor or a pressure sensor;
• a support structure connected to the base by a flexure to be moveable independently of the base and the retaining ring;
• and
• a flexible membrane that defines a boundary of a pressurizable chamber, the membrane connected to the support structure and having a mounting surface for a substrate.