Low density polishing pad
AssigneeCMC Materials, Inc.
InventorsPing Huang, William C. Allison, Richard Frentzel, Paul Andre Lefevre, Robert Kerprich, Diane Scott
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Abstract
Low density polishing pads and methods of fabricating low density polishing pads are described. In an example, a polishing pad for polishing a substrate includes a polishing body having a density approximately in the range of 0.4-0.55 g/cc. The polishing body includes a thermoset polyurethane material and a plurality of closed cell pores dispersed in the thermoset polyurethane material. Each of the plurality of closed cell pores has a shell composed of an acrylic co-polymer.
Claims11
A polishing pad for polishing a substrate, the polishing pad comprising:
- a polishing body having a density approximately in the range of 0.4-0.55 g/cc and comprising:
- a thermoset polyurethane material;
- and
- a plurality of closed cell pores dispersed in the thermoset polyurethane material, each of the plurality of closed cell pores having a shell comprising an acrylic co-polymer, wherein the plurality of closed cell pores has a multi-modal distribution of diameters, and wherein the plurality of closed cell pores provides a total pore volume in the thermoset polyurethane material approximately in the range of 50-60% of the total volume of the thermoset polyurethane material.
Dependencies are inferred from the claim text.